Chips may likely to introduce with having equal parts which means to operate half the transistors for few years and to operate other transistors for next years. This can make iPhone to be faster to perform when it become older. I don’t know, whether this make possible ? But if the chips can come with this process , it would help to stay longer and lasting iPhone. But we may have to think of dissipation. Heat dissipation was an evil on every chips. The idea seems to be more useful when it may work for researches. Seamless design will be needed for cooling system in iPhones. As long as, new cooling technology has to include above or over the side of the chip to catch up heat and is dissipate through either over the SIM slot hole. But customers may not be have to experience the dissipated heat. For this , there must be a cooling system that stores and produces cool to that dissipated thing and makes to move along the SIM slot. This creates iPhone to cool among what the customers may experience over chip side from outside.
Low power design chip will also seems to make to dissipate less heat. But this can treat only few years and the few transistors may come to destroy of itself when the dissipation is more.
Technological Stories 